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芯联集成(688469) - 芯联集成电路制造股份有限公司2024年9月9日投资者关系活动记录表

Group 1: Financial Performance - The company's revenue for the first half of 2024 reached 28.8 billion CNY, a year-on-year increase of 14.27% [5] - To meet the employee incentive target for 2024, the company needs to achieve approximately 40 billion CNY in revenue in the second half, requiring a growth rate close to 30% [3] - The company reported a net loss of -4.71 billion CNY for the first half of 2024, which is a reduction in loss by 6.38 billion CNY compared to the previous year, marking a 58% improvement [8] Group 2: Market Segments - Revenue from the automotive sector accounted for 48% of total revenue, while the consumer electronics sector contributed 34% [5] - The company's SiC MOSFET product shipments ranked first in China for both 2023 and the first half of 2024, with a year-on-year growth of 300% [11] - The company has established a significant presence in the AI sector, with plans to release multiple AI-related product technology platforms in 2024 [2] Group 3: Production Capacity - As of June 2024, the company has built two 8-inch silicon wafer production lines with a monthly capacity of 170,000 wafers and a SiC wafer production line with a capacity of 5,000 wafers [3] - The utilization rate of the 8-inch silicon-based product line is fully loaded, indicating strong market demand [3] - The company aims to achieve a production capacity of 10 billion CNY in SiC products by 2024 [6] Group 4: Strategic Initiatives - The company plans to launch a high-reliability, high-performance MCU platform in the second half of 2024 [12] - Following the acquisition of ChipLink, the company will enhance its control over production capabilities and technology sharing, aiming for higher value-added products [12] - The company is focusing on expanding its market share in the automotive and industrial control sectors, with ongoing collaborations with major OEMs and Tier 1 customers [11]