Guangdong Skychem Technology (SH:688603)2024-10-17 07:34Group 1: Company Overview and Recent Developments - Tiancheng Technology has seen a recovery in the PCB manufacturing sector, leading to a steady increase in overall business performance [2] - The company has successfully expanded its high-margin product sales and is continuously developing high-end clients [2] - The semiconductor division has been established under the leadership of the new CTO, Dr. Han Zuoyan, who has extensive experience in electronic plating [3] Group 2: Semiconductor Division and Product Development - The semiconductor team has been formed, covering R&D, production, quality, and sales, with a complete operational mechanism established [3] - The company aims to become a major supplier for mainstream packaging and testing customers within the next two years [4] - A target of achieving over 30% market share in domestic plating additives from advanced packaging to wafer manufacturing within three years has been set [4] Group 3: Competitive Landscape - Major competitors in the wafer-level plating additives include international giants such as Moxihua, Integra, and Basf [3] - In the advanced packaging plating additives sector, competitors include Medemel, DuPont, and Amtech [3] Group 4: Product Validation and Market Strategy - The company is focusing on advanced packaging products, ensuring quality and driving technological innovation [4] - Current testing of TGV plating products is ongoing with over ten downstream clients, and small batch sales have been achieved [4] - The differences between TGV and TSV plating products are highlighted, with TSV requiring solutions for smaller openings and deeper aspect ratios [4]