Group 1: Company Overview - The company, founded in 1998, specializes in semiconductor testing and packaging equipment, with a comprehensive product line including automated testing systems and laser marking equipment [1] - The first laser marking device was launched in 2001, gaining recognition from leading semiconductor packaging clients [1] Group 2: Market Outlook and Plans - For Q4 2024, the company aims to enhance operational quality and increase market competitiveness, targeting revenue goals amidst rising demand for silicon carbide (SiC) semiconductors [2] - SiC semiconductors are expected to see broader applications in electric vehicles and renewable energy sectors due to their ability to operate at higher temperatures and voltages [3] Group 3: Customer Base - Major clients include renowned power semiconductor manufacturers and leading packaging companies, with a shift from packaging firms to Integrated Device Manufacturers (IDM) as primary customers [3] Group 4: Future Investments and Product Development - The company is focused on its core business while monitoring potential acquisition opportunities for upstream or horizontal integration [3] - Future product development will emphasize power semiconductor testing, KGD testing, and large-scale digital integrated circuit testing systems, with ongoing collaborations with notable clients [3] Group 5: Growth Drivers - Anticipated business growth will primarily stem from power semiconductor testing systems, leveraging technological advantages and a solid business foundation [4]
联动科技(301369) - 2024年10月30日投资者关系活动记录表