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深南电路(002916) - 2024年11月6日投资者关系活动记录表
SCCSCC(SZ:002916)2024-11-06 13:25

Financial Performance - In the first three quarters of 2024, the company achieved a total revenue of 13.049 billion RMB, representing a year-on-year growth of 37.92% [1] - The net profit attributable to shareholders reached 1.488 billion RMB, with a significant increase of 86.67% [1] - For Q3 2024, the company reported a revenue of 4.728 billion RMB, showing a year-on-year growth of 37.95% [2] - The net profit for Q3 2024 was 501 million RMB, reflecting a year-on-year increase of 51.53% [1] Business Growth Drivers - The growth in revenue and profit is attributed to the company's ability to seize structural opportunities in the industry and enhance market expansion efforts [1] - The increase in orders and revenue across three main business segments was noted, driven by the acceleration of AI applications and the ongoing trends in automotive electrification and intelligence [1] Segment Performance - The PCB business saw revenue growth in data centers and automotive electronics, while the communication sector experienced a decline in revenue share due to stagnant demand [2] - The company is focusing on the data center sector, with significant growth in orders driven by AI server demand and upgrades in general server platforms [2] Production Capacity and Expansion - The company is investing 1.274 billion RMB in a factory in Thailand to expand its overseas market presence [2] - There is potential for further capacity expansion through technological upgrades in existing PCB factories and new construction in Nantong [2][3] Operational Metrics - The PCB factory's operating rate remained stable at a high level, while the packaging substrate factory's rate slightly declined due to fluctuations in downstream demand [3] - The company has achieved breakeven for its second-phase factory in Wuxi and is progressing with capacity ramp-up for the Guangzhou packaging substrate project [3] Technology Development - The company has developed mass production capabilities for FC-BGA substrates with up to 16 layers and is advancing the certification process for 20-layer products [3]