CFMEE(SH:688630)2024-11-14 08:24Group 1: Company Overview and Investor Relations - The company is Hefei Chipqi Microelectronics Equipment Co., Ltd., with stock code 688630 [1] - The investor relations activity included a phone conference with various investment firms [1][2][3][4][5][6][7][8][9][10][11][12][13][14] Group 2: Advanced Packaging Technology - The company focuses on advanced packaging technology, highlighting the advantages of direct-write lithography in heterogeneous packaging [6][7] - The market share of advanced packaging technology is gradually increasing, driven by demand for high-end chips in 5G, IoT, and AI applications [7][8] - Direct-write lithography technology offers cost and operational advantages over traditional mask-based lithography, especially in large-area chip packaging [8][10] Group 3: Equipment Development and Market Demand - The company’s bonding equipment supports 8-inch wafers and is expected to be launched soon [8] - The WLP2000 wafer-level packaging equipment is mature, with ongoing research for higher-end products [9] - The company is actively promoting laser drilling equipment, which has significant market demand and low domestic production rates [9][10] Group 4: Future Outlook and Strategic Initiatives - The company is optimistic about the future of PCB production, driven by automation and large customer strategies [13] - There is a growing demand for AI chips and related cooling solutions, with the company adapting its products to meet these needs [13][14] - The company is positioned to capture new market opportunities through technological innovation and product development [10][12][14]