Workflow
大族数控(301200) - 2024年12月3日投资者关系活动记录表

Company Overview - The company specializes in the R&D, production, and sales of PCB (Printed Circuit Board) equipment, covering key processes such as lamination, drilling, exposure, forming, and inspection [2] - It offers a wide range of PCB processing solutions, including mechanical drilling, laser drilling, laser direct imaging, mechanical forming, and automated optical inspection [2] - The company has expanded into the tooling sector, providing PVD nano-coating services to reduce operational costs for downstream customers [3] - With over 20 years of experience in the PCB industry, the company has established strong market leadership and strategic partnerships with leading clients [3] 2024 Performance Highlights - The company's revenue growth in the first three quarters of 2024 was driven by the recovery of the consumer electronics market, advancements in new energy vehicle electronics, and strong demand from the AI server and computing power industry chain [3] - Innovative products and enhanced market competitiveness contributed significantly to the growth in sales of specialized processing equipment [3] Traditional PCB Market - In the highly competitive multi-layer PCB market, the company introduced second-generation automated drilling solutions, high-power solder mask laser direct imaging systems, and automated forming machines, reducing labor costs and improving equipment utilization for clients [3] - The company plans to deepen its presence in the multi-layer PCB market by increasing R&D efforts and offering tailored solutions for different end markets [3] High-Tech PCB Products and Trends - The AI computing power industry chain is driving demand for high-speed communication equipment, high-end AI servers, and large data centers, leading to increased demand for high-layer count PCBs, HDI boards, and large-size packaging substrates [4][5] - The company has developed advanced products such as 3D back-drilling CCD six-axis mechanical drilling machines, high-power CO2 laser drilling machines, and high-performance laser direct imaging systems to meet the needs of high-layer count PCBs in AI servers and high-speed switches [5] - In the HDI market, the company has upgraded its CO2 laser drilling machines, high-resolution laser direct imaging systems, and precision testing machines to meet the increasing technical demands of the market [6] - The company has also developed new laser processing solutions for advanced packaging substrates, which have been certified by leading industry clients and are expected to boost sales of high-value-added PCB processing equipment [7] Investor Relations Activities - The company conducted various investor relations activities, including analyst meetings, media interviews, and on-site visits, from October 30 to December 3, 2024, with participation from major securities firms and asset management companies [2]