Orbbec (688322)2024-12-20 10:11Group 1: Company Overview and Technology - The company focuses on "full-stack technology R&D capabilities + full-field technology layout" to build a 3D visual perception technology system, achieving global leadership in the 3D vision industry [2] - The chip team has developed proprietary chips, including the MX series structured light depth engine chip, which has undergone 5 iterations [2] - The MX series depth engine chip is a system-level SoC chip that performs real-time depth calculations, significantly reducing power consumption and physical size while enhancing processing capabilities [2] Group 2: Production and Manufacturing - The company has invested in a "3D visual perception industry intelligent manufacturing base" in Shunde, Guangdong, with the first phase successfully launched by the end of 2023 [2] - The original manufacturing site in Dongguan was less than 30,000 square meters and could not meet the growing business needs due to rapid growth since 2024 [2] - The Shunde base incorporates intelligent and automated upgrades to optimize product structure, improve production efficiency, and reduce costs [2] Group 3: Product Development and Collaborations - In August 2023, the company launched the 3D development kit Persee N1 in collaboration with NVIDIA, applicable in mobile perception, obstacle recognition, and body interaction [6] - The Orbbec Perceptor Developer Kit (OPDK) was introduced at the ROSCon conference in October 2024, featuring four Gemini 335L cameras and supporting advanced depth processing capabilities [6] - The OPDK integrates seamlessly with NVIDIA's Jetson AGX Orin system module, providing up to 275 TOPS of computing power for complex tasks like visual SLAM and object detection [6]