Financial Performance - The company expects a net profit of -200 million to -170 million CNY for 2024, marking its first loss since its listing in 2010 [3] - The overall cost input for the FCBGA packaging substrate project is over 760 million CNY, an increase of over 364 million CNY year-on-year [3] - The combined expected losses for subsidiaries Yixing Silicon Valley and Guangzhou Xingke in 2024 are approximately 203 million CNY, an increase of about 77 million CNY [3] - The total impact on net profit after tax from various factors is approximately 180 million CNY [4] Industry Overview - The PCB industry is expected to grow by 5.8% in 2024 and 6.1% in 2025, with a projected market value increase from 73.6 billion USD to 91.1 billion USD from 2023 to 2028, reflecting a compound annual growth rate of 5.6% [5] - The best-performing sectors are AI and renewable energy, particularly in the server/data center market, which is expected to remain strong in 2025 [5] Project Updates - The FCBGA packaging substrate project has exceeded an investment of 3.5 billion CNY and is currently in small-batch production, focusing on market expansion and ramping up production [6] - The CSP packaging substrate business is expected to maintain steady growth in 2024, driven by increased market share from major storage clients [7] - The semiconductor test board business has seen continuous improvement in capacity utilization and product quality, contributing to revenue growth [8] Strategic Focus - The company is committed to digital transformation and high-end packaging substrate strategies, aiming to enhance competitiveness through quality and efficiency improvements [14] - Future investments will focus on expanding production capacity for CSP packaging substrates and advancing customer certification for FCBGA packaging substrates [14] AI Sector Engagement - The company is actively investing in AI-related PCB and semiconductor businesses, with a focus on enhancing production capacity for AI server applications [12]
兴森科技(002436) - 2025年1月21日投资者关系活动记录表