Group 1: Business Overview - The company primarily exports to Germany, Hungary, and Malaysia, with a small quantity of samples sold to the United States [2] - The demand for power semiconductor module heat dissipation substrates is expected to grow rapidly due to the booming new energy vehicle industry [3] Group 2: Corporate Governance and Management - The company plans to enhance its governance and management systems to ensure scientific and effective operations [4] - Key focus areas include improving internal control systems and establishing a clear governance structure [4] Group 3: Product Development and Market Strategy - The company aims to increase R&D investment to adapt to industry trends and technological advancements [5][7] - Plans to expand product applications and explore new growth areas to enhance sustainable development capabilities [5][7] Group 4: Financial Performance and Investor Relations - The company will hold its annual shareholder meeting on May 15, 2025, to discuss dividend distribution [4] - A commitment to improving operational quality and establishing a regular dividend mechanism to enhance investor returns [6] Group 5: Future Growth and Market Positioning - The company will focus on market capture and cost reduction strategies to improve operational performance in 2025 [7][8] - Emphasis on modular design to lower manufacturing costs and improve efficiency through optimized supply chain management [8]
黄山谷捷(301581) - 301581黄山谷捷投资者关系管理信息20250508