Financial Performance - The company's net profit for 2024 reached 930 million CNY, a year-on-year increase of 44.33% [2] - Revenue from the storage semiconductor business was 3.522 billion CNY, growing by 37.62% compared to the previous year [3] Business Operations - The company operates dual bases for semiconductor packaging and testing in Shenzhen and Hefei, with ongoing capacity improvements [3] - The Shenzhen base received a Level 3 certification for intelligent manufacturing, while the Hefei base was recognized as a digital workshop in Anhui Province [3] R&D and Technology - The company is focusing on advanced packaging technologies, including Bumping and RDL projects, which have achieved mass production [3] - The company has increased its R&D personnel, particularly in the storage semiconductor sector [6] Market Strategy - The global semiconductor market is projected to grow by 11.2% in 2025, reaching a size of 697 billion USD, with strong growth in the storage market driven by AI and high-performance computing [8] - The company aims to enhance its market position by optimizing its supply chain strategy and expanding into European and other international markets [7] Risk Management - The company has a robust accounts receivable management system, with accounts receivable primarily aged within one year, mitigating large-scale bad debt risks [3] - The company is committed to adhering to market regulations and enhancing its value management practices [4] Future Outlook - The company plans to transition from manufacturing to creating value through supply chain solutions, focusing on digitalization and AI applications [6] - The company aims to strengthen its position in the semiconductor packaging sector and enhance its capabilities in high-end manufacturing [5]
深科技(000021) - 000021深科技业绩说明会、路演活动信息20250516