Summary of Conference Call for Aisen Co., Ltd. Industry Overview - The focus for investment this year (2025) is on self-sufficiency, particularly in the equipment and materials sectors, with domestic companies actively replacing foreign products [2][3] - The advanced packaging sector is trending towards higher integration and heterogeneous integration, with 2.5D and 3D packaging becoming key directions for GPU and AI chip development [2][4] Company Insights - Aisen Co., Ltd. has launched mass production of its positive DNQ series photoresist products, with a high market share expectation, while the negative acrylic series holds about a low double-digit percentage [2][6] - The company is conducting chemical amplification RDL photoresist tests, with client validation expected in the second half of the year, aiming for a comprehensive product layout [2][6] - Aisen's positive DNQ and negative acrylic series have gained market share in the domestic advanced packaging sector, which primarily uses JSR's post-film revival photoresist [2][7] Market Dynamics - The HBM memory market is currently dominated by international giants, but domestic companies are gradually entering this space [2][7] - Due to international political factors, the supply of HPV3 and subsequent products is limited, necessitating independent development of related technologies in China [2][8] - The TSV (Through-Silicon Via) technology is crucial in HBM structures, and Aisen is developing TSV photoresist and high-speed copper plating products [2][9] Product Development and Strategy - Aisen is focusing on developing new PSPI materials to meet the diverse needs of advanced packaging, with plans to become a leading supplier in this area within two to three years [2][4][14] - The company has established a strategic partnership with Shenghe Jingwei, focusing on electroplating and photoresist products, with significant sales growth expected [2][26] - Aisen's business performance in the advanced packaging sector is projected to grow rapidly, with a target of achieving significant sales in the wafer and advanced packaging fields [2][14][31] Challenges and Opportunities - The ongoing trade tariff war has increased material procurement costs for several packaging and testing companies, prompting a shift towards domestic materials [2][33] - The domestic PSPI market is still in its infancy, with a market size of approximately 1.5 billion RMB, and Aisen is working to increase its market share through product development and client validation [2][17][22] - The company is addressing supply chain challenges by developing multiple alternative solutions to mitigate reliance on single products [2][19] Future Outlook - Aisen anticipates structural growth driven by increasing demand from domestic clients, particularly in the HBM sector, and plans to expand its product offerings to meet market needs [2][28] - The company aims to enhance its domestic replacement rate and market share through improved risk control and technology advancements [2][25]
艾森股份20250526