Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services for design simulation and packaging testing across various fields including AI, high-performance computing, and 5G [2]. - The company has established production bases in multiple locations, including Nantong, Suzhou, Penang, Hefei, and Xiamen, enhancing its capacity to serve clients locally [2][3]. - In 2024, the company acquired a 26% stake in Jinglong Technology, which is expected to improve investment returns and create more value for shareholders [2]. Financial Performance - Revenue figures for the years 2021 to 2024 are as follows: - 2021: ¥158.12 billion - 2022: ¥214.29 billion - 2023: ¥222.69 billion - 2024: ¥238.82 billion [3]. - Net profit for the same years: - 2021: ¥9.57 billion - 2022: ¥5.02 billion - 2023: ¥1.69 billion - 2024: ¥6.78 billion [3]. - In Q1 2025, the company achieved revenue of ¥60.92 billion, a year-on-year increase of 15.34%, and a net profit of ¥1.01 billion, up 2.94% [4]. Industry Trends - The semiconductor industry is entering an upward cycle, with global sales expected to reach $627.6 billion in 2024, a 19.1% increase from $526.8 billion in 2023 [3]. - The global integrated circuit packaging and testing market is projected to grow to $82 billion in 2024, reflecting a 7.8% year-on-year increase [3]. - Key trends for 2025 include continued AI-driven growth, a 15% increase in the Asia-Pacific IC design market, and a focus on advanced packaging technologies [3]. Business Growth Areas - In 2024, the company saw significant growth in various sectors: - 46% increase in mid-to-high-end mobile SOCs - 20% growth in mobile terminal SOC partnerships - 70% increase in RF sector collaborations - Over 200% growth in automotive products [5][8]. - The company is expanding its capabilities in advanced packaging technologies, including Chiplet and 2D+ packaging [5][6]. Future Investments - The company plans to invest ¥6 billion in 2025 for facility construction, production equipment, IT, and R&D [8]. - Specific investments include: - ¥2.5 billion for new factory construction and product development in various sectors - ¥3.5 billion for upgrading existing products to meet the demand for large multi-chip servers and AI applications [8].
通富微电(002156) - 002156通富微电投资者关系管理信息20250625