SCC(SZ:002916)2025-07-03 10:24Group 1: Company Overview and Market Position - The company maintains high factory utilization rates, benefiting from strong demand in computing power and automotive electronics markets [1] - The PCB business focuses on high-end products, particularly in the fields of new energy and ADAS, with applications in industrial control and medical sectors [1] - The company has established factories in Shenzhen, Wuxi, Nantong, and Thailand, with ongoing capacity expansion projects [3] Group 2: PCB Business Demand and Trends - There is an increasing demand for large-size, high-layer, high-frequency, and high-speed HDI PCB products, driven by advancements in technology [2] - The PCB business has seen growth in demand for products used in high-speed communication networks, data center switches, AI accelerator cards, and storage devices since 2024 [2] Group 3: Expansion Plans and Investments - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing capabilities in high-layer and HDI PCB technologies [4] - The company is upgrading existing PCB factories to increase capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [3] Group 4: Packaging Substrate Business - The packaging substrate business includes a wide range of products, with demand improving in Q1 2025 compared to Q4 2024, particularly for storage-related products [5] - The FC-BGA packaging substrate can now produce products with up to 20 layers, with ongoing development for higher-layer products [6] Group 5: Electronic Assembly Business - The electronic assembly business focuses on communication, data centers, medical, and automotive electronics, aiming to provide integrated solutions and enhance customer loyalty [7] - The company adheres to information disclosure regulations, ensuring no significant undisclosed information was leaked during the investor relations activities [7]