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中京电子(002579) - 002579中京电子投资者关系管理信息20250919
CEETCEET(SZ:002579)2025-09-19 12:46

Group 1: Market Demand and Product Applications - The company focuses on the research, production, and sales of printed circuit boards (PCBs), including rigid multilayer PCBs (MPC), high-layer count boards (HLC), high-density interconnect boards (HDI), flexible circuit boards (FPC), flexible circuit board assemblies (FPCA), and rigid-flex boards (R-F) [1] - Emerging technologies such as artificial intelligence, next-generation networking, and automotive electronics are driving demand in related downstream application fields, prompting the company to accelerate capacity ramp-up of its Zhuhai project and optimize product structure [1] - The company’s PCB products can be applied in data center-related areas, including servers, storage devices, optical modules, and GPU accelerator cards [2] Group 2: Investment and Production Scale - The investment scale for the Thailand smart factory project (Phase I) is approximately 550 million yuan, with construction actively progressing [2] - The company is currently a secondary supplier to Huawei, primarily involved in mobile phones, tablets, and consumer electronics, but does not provide PCB substrates for Huawei's AI chips [2] Group 3: Stock Performance and Market Management - The company's stock price is currently at a lower level compared to peers, influenced by multiple factors, and the company encourages investors to view short-term market fluctuations rationally [2] - The company aims to strengthen communication with investors and enhance compliance information disclosure to share development achievements [2]