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全球半导体 -用于先进封装的碳化硅(SiC):识别投资机会-Global Semis SiC for advanced packaging Identifying the investment opportunities
TSMCTSMC(US:TSM)2025-09-25 05:58

on 24-Sep-2025 24 September 2025 Global Semis Global Semis: SiC for advanced packaging? Identifying the investment opportunities David Dai, CFA +852 2918 5704 david.dai@bernsteinsg.com Mark Li +852 2123 2645 mark.li@bernsteinsg.com Juho Hwang +852 2123 2632 juho.hwang@bernsteinsg.com Carmine Milano +44 207 762 1857 carmine.milano@bernsteinsg.com Edward Hou, CFA +852 2123 2623 edward.hou@bernsteinsg.com Yipin Cai, CFA +852 2123 2669 yipin.cai@bernsteinsg.com According to news reports, TSMC is considering usi ...