Group 1: Company Overview - New Henghui Electronic Co., Ltd. is focused on the production of eSIM chip packaging and etching lead frame products, primarily serving the IoT and consumer electronics sectors [2][3]. Group 2: Market Competition and Positioning - The eSIM chip packaging market is highly specialized, with limited comparable companies available for reference. New Henghui holds a leading technical advantage over domestic competitors, despite differences in scale and product range compared to international leaders [3]. - The etching lead frame market in mainland China is characterized by a weak manufacturing base and significant capacity shortages, with only a few companies capable of mass production [3]. Group 3: Product Development and Market Demand - New Henghui has developed a range of etching lead frame products, including CuAg, PPF, and Flip Chip series, and plans to introduce automotive-grade products to meet the growing demand in consumer electronics, IoT, automotive electronics, and industrial control sectors [4]. - The company aims to enhance its product structure by focusing on high-end products and deepening strategic partnerships with upstream suppliers, while also investing in new technologies and product lines [4]. Group 4: Strategic Planning - Over the next 3-5 years, the company will concentrate on three main business areas: smart card business, etching lead frame business, and eSIM chip packaging, with a focus on continuous technological and business innovation [5][6]. - The strategy includes enhancing brand recognition, expanding the customer base, and increasing profitability, while also strengthening the marketing team to boost international brand awareness and customer engagement [6].
新恒汇(301678) - 301678新恒汇投资者关系管理信息20260114