DR Laser(SZ:300776)2026-01-21 02:05Summary of Conference Call on Company and Industry Insights Industry and Company Overview - The conference call focused on the laser equipment industry, particularly the advancements in photovoltaic (PV) technology and semiconductor equipment, with a specific emphasis on the company 帝尔激光 (Dier Laser) [1][2]. Key Points and Arguments - Increase in Single GW Value: The single GW value has increased from 50 million/GW to at least 70-80 million/GW. This enhancement is attributed to: 1. New crystallization equipment contributing over 10 million per GW. 2. Anticipated bulk orders for metallization processes, including electroplating and copper paste sintering this year. 3. Layout of two welding routes for full plate welding and conductive backplane interconnection, with mass production orders expected to materialize by the first half of 2026 [1]. - Space Photovoltaics: 1. HJT (Heterojunction Technology) is being developed with laser transfer printing, induced repair, and sintering, all of which are mature mass production processes. The single GW value can reach 50 million/GW. 2. Perovskite technology is being explored with laser grooving and slicing, achieving a single GW value in the tens of millions [1]. - Innovative Equipment and Multi-functional Devices: The company is set to receive orders from leading customers in Jiangsu and is also in discussions with clients in Beijing regarding innovative equipment and processes [2]. - Adaptation to Thin Silicon and Flexible Components: Full plate welding and conductive backplane interconnection are naturally suited for ultra-thin silicon wafers and flexible components. Laser technology remains the core of all battery technology routes, with a high upper limit for single GW value this year marking a year of new laser technologies [3]. - Semiconductor Product Layout: The company aims for non-PV orders to reach 1 billion in 2026. The target for TGV (Through Glass Via) orders this year is over a hundred units. PCB (Printed Circuit Board) prototypes are expected to be delivered in February for validation [3]. - Advanced Semiconductor Packaging: The use of laser technology for advanced packaging, such as laser transfer printing for ball placement (tin ball dot printing) and laser drilling for optical fiber arrays in AFU (Active Fiber Unit) modules, is highlighted [4]. - Dual-Drive Strategy: The combination of photovoltaic and semiconductor sectors is driving growth, with space photovoltaics opening new opportunities for the company [4]. Other Important Insights - The emphasis on laser technology across various applications indicates a strategic focus on innovation and efficiency in production processes. - The anticipated growth in both the photovoltaic and semiconductor sectors suggests a robust market outlook for the company, positioning it well for future developments and potential investment opportunities [1][3][4].