Nvidia(US:NVDA)2026-01-21 02:20Summary of Conference Call Notes Company and Industry Involved - Company: 长江电子 (Changjiang Electronics) - Industry: Communication Solutions, specifically focusing on backplane technology Core Points and Arguments 1. Orthogonal Backplane Viability: - The orthogonal backplane remains the most reliable communication solution within the Rubin-Ultra framework despite concerns about its performance based on recent testing results [1] - Current backplane design utilizes 78-layer M9 material, with suppliers testing 94-layer and 104-layer options to enhance impedance performance and connector reliability [1] 2. Signal Performance Improvement: - A less dense wiring approach is expected to yield faster signal speeds and reduced interference, thereby improving transmission speed and minimizing signal disruption [1] 3. Delay Risks: - The risk of delay in the orthogonal backplane development is considered low, with M9 material still dominating the market, while PTFE material remains a potential alternative [2] - Nvidia has not abandoned PTFE material, which has a low loss factor, and plans to continue testing it to improve yield, processability, and stability [2] 4. Current Progress: - The orthogonal backplane is currently in the second round of sample submissions, with 15 samples expected to be delivered by mid-February [3] - Nvidia plans to showcase the orthogonal backplane at the GTC conference in March, indicating strong certainty of its implementation [3] Other Important but Potentially Overlooked Content - The ongoing competition between M9 and PTFE materials could influence the timeline and final decision on the backplane technology, as the uncertainty surrounding PTFE's development may affect the overall project schedule [2]