Nvidia(US:NVDA)2026-02-28 02:55Summary of Longjiang Electronics Conference Call Industry Overview - The conference call discusses advancements in the PCB (Printed Circuit Board) industry, particularly focusing on the upcoming launch of the Feynman architecture chip by Nvidia, which is expected to create new growth opportunities in the sector [1]. Key Points and Arguments - Nvidia plans to unveil the Feynman architecture chip at the GTC 2026 conference, with the release occurring earlier than market expectations [1]. - The core technological breakthrough of the Feynman architecture lies in its 3D stacking method, which integrates the LPU (Logic Processing Unit) chip optimized for inference tasks directly onto the GPU (Graphics Processing Unit) computing core, enabling deep physical integration of general and specialized computing [1]. - The new LPU chip is primarily designed for inference, utilizing a high multi-layer approach, with the value of a single chip PCB expected to reach between $300 to $500 [1]. - Key suppliers to watch in this space include Shenghong Technology, Huidian Co., Shenzhen South Circuit, and Jingwang Electronics [1]. Additional Important Insights - The CoWoP (Chip-on-Wafer-on-Panel) technology is anticipated to enter small-scale production by the end of 2027 and large-scale production in 2028, potentially increasing the PCB value per square meter by several times, up to tenfold [1]. - The orthogonal backplane project is progressing steadily, with a new round of sample testing planned for early March. This project is expected to enter mass production in the second half of 2027 [1]. - There is a strong recommendation to focus on undervalued leading companies in this sector, as their cost-performance ratio is expected to become more prominent [1].