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气派科技(688216) - 投资者关系活动记录表
CHIPPACKINGCHIPPACKING(SH:688216)2022-11-19 01:12

Financial Performance - In 2021, the company achieved a production volume of 10.3 billion units and a revenue of 809 million yuan, representing a 47.69% increase from 2020 [2] - The net profit attributable to shareholders was 135 million yuan, up 67.46% year-on-year, while the net profit excluding non-recurring items was 126 million yuan, reflecting a growth of 69.45% [2] - In Q1 2022, revenue dropped to 126 million yuan, a decline of 17% year-on-year, with a net loss of 6.1 million yuan, down 130% compared to the previous year [2] Production Challenges - The first quarter of 2022 faced significant production challenges due to external factors, including a reduction of 16 effective production days caused by the pandemic, holiday breaks, and power outages [2] - The company experienced a temporary shutdown of 4 days in March 2022, impacting production efficiency [3] - Despite these challenges, production efficiency has begun to recover as the pandemic situation improves in key areas [3] Market and Product Development - The company has made progress in automotive-grade chip packaging, having passed the IATF 14969:2016 certification, although formal production has not yet commenced [3] - The advanced packaging segment has seen growth, with expectations to increase from 28% in 2021 to 35% in 2022 [4] - The company is focusing on developing GaN (Gallium Nitride) technology for 5G base stations, which is a significant market segment [4] Cost and Pricing Dynamics - Material costs have remained high, with packaging materials accounting for 30-40% of total costs last year, while labor and manufacturing costs have increased significantly [5] - The company has adjusted packaging prices slightly in response to material cost increases, but overall price changes have been minimal [6] Future Outlook - The company plans to continue increasing capital investment to expand production capacity and align product development with customer needs [8] - The competitive landscape for third-generation semiconductor packaging is intense, with several leading domestic companies involved [5] - The company aims to enhance its market share by competing with top-tier enterprises in the industry [7]