HHCK(SH:688535)2024-03-06 07:36Group 1: Company Overview - The company is identified by the stock code 688535 and is named Huahai Chengke [1]. Group 2: Investor Relations Activity - The investor relations activity took place on March 5, 2024, from 14:00 to 16:00 at a physical location [2]. - Participants included representatives from Kaiyuan Securities and Huazheng Securities [2]. Group 3: Product Information - LMC refers to liquid molding compound, which enhances the flow of liquid resin under temperature and pressure, filling the entire wafer. It is known for low warpage, low moisture absorption, and high reliability [3]. - GMC refers to granular epoxy molding compound, which is simpler to operate and has lower costs, but is less mature compared to LMC [3]. - The company is currently working on high-end epoxy molding materials, which still rely on foreign technology for mass production [3]. Group 4: Market Applications - The company's granular epoxy molding compound (GMC) can be applied in the HBM storage industry and is currently in the sample delivery stage [4]. - The company has not yet established direct business relations in the optical module production sector, which is crucial for fiber optic communication systems [4]. Group 5: Technical Comparisons - QFN (Quad Flat No-lead) and DFN (Dual Flat No-lead) are both surface mount packages, with QFN having electrode contacts on four sides and DFN having contacts only on two sides, making DFN suitable for applications requiring high thermal conductivity with fewer pins [4].