Group 1: Company Overview and Market Position - Gaoce Technology Co., Ltd. leads the market in slicing machines and has recently entered the slicing service sector, enhancing its competitive advantages in the semiconductor field [3] - The company maintains a strong focus on R&D in high-hard and brittle material cutting, leveraging its foundational capabilities in cutting equipment, consumables, and processes [3] - The market share of slicing machines continues to rise, with successful vertical expansion into slicing services and significant progress in innovative businesses such as semiconductors [3] Group 2: Strategic Collaborations and Technological Advancements - The company signed a strategic cooperation agreement with Aikang Technology to establish a joint laboratory aimed at reducing the thickness of heterojunction large-size silicon wafers from 150μm to 120μm and 90μm [4] - The company is actively investing in R&D to address the challenges posed by the rapid technological iterations in the industry, focusing on "large size, thin slicing, automation, and intelligence" [4] Group 3: Financial Performance and Revenue Composition - In Q1 2022, the company achieved a revenue of approximately 5.56 billion, with main business revenue around 5.46 billion [5] - The revenue composition includes approximately 42% from high-hard and brittle material cutting equipment, 32% from silicon wafers and cutting processing services, and 24% from tire testing equipment and other services [6] Group 4: Product Development and Market Trends - The company has successfully achieved batch sales of 40μm and 38μm diamond wires, with ongoing development for 35μm and below [4] - The diamond wire gross margin has improved to 47.62% in Q1 2022, reflecting the company's technological advancements in cost reduction [4] - The company’s innovative business in the semiconductor and sapphire cutting sectors has seen a revenue increase of 323.05% year-on-year, with expectations for continued high growth in 2022 [4]
高测股份(688556) - 投资者关系活动记录表688556-(2022年5月)