天承科技(688603) - 投资者关系活动记录表(2023年12月20日)

Group 1: Financial Performance and Market Impact - In Q4 2023, the sales revenue was significantly affected by the fluctuation in the price of palladium sulfate, with the average procurement price dropping by nearly 50% [2] - The decline in procurement costs led to a decrease in the overall revenue from the company's main product, which is linked to the international palladium price [2] - The company has a substantial market share in the domestic level copper plating products, with ongoing efforts to replace international brands [3] Group 2: Industry Trends and Opportunities - The industry is experiencing price pressure, but the company's focus on high-end electronic circuit core products mitigates the impact [2] - The low operational rates of downstream customer factories have provided more opportunities for product replacement [3] - The shift of the domestic PCB industry chain to Southeast Asia is expected to create considerable incremental market opportunities [3] Group 3: Product Development and Innovation - The company is actively developing various types of PCB electroplating products, including non-soluble anode direct current and pulse plating systems [4] - The company has established a presence in traditional packaging fields, leveraging its extensive experience in copper plating and electroplating [4] - The company is focusing on advanced packaging electronic chemicals, particularly in RDL and bumping applications, with initial validations completed for related base liquids and additives [4]