TFME(SZ:002156)2022-12-07 09:40Group 1: Company Overview - Tongfu Microelectronics primarily engages in integrated circuit packaging and testing services, offering over 500 products including microprocessors and various types of circuits [1] - The company has a competitive edge in packaging technology for mid-to-high-end products, with key products including BGA, QFP/LQFP, QFN, and POWER [1] Group 2: Industry Trends - The semiconductor industry is characterized by significant volatility and cyclical trends, but it has recently emerged from a downturn, with favorable market prospects due to national emphasis on information security and supportive industrial policies [2] - The integrated circuit industry is expected to have substantial growth potential, similar to Taiwan's industry a decade ago [2] Group 3: Strategic Direction - The company aims to enhance profitability through a "dual-driven" approach, which includes: 1. Internal development to increase production capacity and optimize product structure 2. External mergers and acquisitions to adjust product structure and facilitate transformation [2] Group 4: Product Structure - The product structure consists of approximately 40% high-pin products, 40% low-pin products, and 20% POWER series products, with high-pin products including BGA, QFP/LQFP, and QFN [2] - The POWER series products have a wide range of applications and stable market demand, contributing to resilience against industry fluctuations [3] Group 5: Production Capabilities - The company has successfully produced 28nm BUMP and FC products, passing customer assessments on the first attempt [3] Group 6: Subsidiary Development - The planning and design for the Suzhou Tongfu Industrial Park subsidiary have been completed, and construction is currently underway [3] Group 7: Environmental Compliance - The company's fundraising project has passed environmental assessments, with established wastewater treatment facilities and compliance with national and local environmental regulations [3]