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兴森科技(002436) - 2023年4月7日投资者关系活动记录表
FAST PRINTFAST PRINT(SZ:002436)2023-04-07 11:10

Group 1: Company Performance and Financials - In 2022, the company's revenue grew by 6.23%, outperforming the industry average growth rate of 1% [3] - Net profit declined due to increased expenses, including 102 million CNY for the FCBGA packaging substrate project and a loss of 82.926 million CNY for the Zhuhai CSP packaging substrate project [3] - As of the end of 2022, accounts receivable amounted to 1,581.2882 million CNY, representing 13.30% of total assets and 29.54% of operating revenue [5] Group 2: Production Capacity and Projects - The Zhuhai FCBGA packaging substrate project has a planned capacity of 200 million units per month (approximately 6,000 square meters per month) and successfully completed trial production by the end of December 2022 [5][6] - The Guangzhou FCBGA packaging substrate project is expected to complete production line construction and begin trial production in the fourth quarter of 2023, with a planned capacity of 20 million units per month (20,000 square meters per month) [3][6] Group 3: Research and Development - In 2022, R&D investment was 383 million CNY, accounting for 7.15% of operating revenue [4] - The company applied for a total of 42 patents in 2022, including 27 invention patents and 15 utility model patents [4] Group 4: Market Outlook and Industry Trends - The PCB industry is expected to experience a "front low, back high" trend in 2023, with Q1 showing no improvement but anticipated recovery in Q2 and positive year-on-year growth in Q3 and Q4 [6] - The company is focusing on high-end markets for packaging substrates, where competition is relatively low compared to traditional PCB sectors [5]