SCC(SZ:002916)2024-03-27 13:42Group 1: Business Overview - The company operates in three main business areas: PCB, packaging substrates, and electronic assembly, with a focus on applications in communication, data centers, automotive electronics, and industrial control [2][3][4]. Group 2: PCB Business Performance - In 2023, the PCB business saw a decline in orders from the communication sector due to weak domestic demand and a slowdown in overseas projects, leading to a proactive optimization of product structure [3]. - The data center sector experienced a slight increase in orders, attributed to the gradual ramp-up of certain products and breakthroughs in new customer development [3]. - The automotive sector saw over a 50% year-on-year growth in orders, driven by opportunities in new energy and ADAS, as well as successful project implementations with new customers [3][5]. Group 3: Packaging Substrate Business - The packaging substrate business includes a wide range of products, with a focus on mobile smart terminals and servers. Despite a weak semiconductor market in the first half of 2023, the company maintained stable revenue through market development and customer acquisition [4]. - The company is the largest domestic supplier of packaging substrates, achieving leading capabilities in various packaging forms and maintaining a competitive edge in specific market segments [4][6]. Group 4: R&D and Innovation - In 2023, the company invested CNY 1.073 billion in R&D, accounting for 7.93% of revenue, with significant progress in technology development for PCB related to communication, data centers, and automotive electronics [5][6]. - The company obtained 95 new patents and applied for 6 PCT patents, with several products and technologies reaching leading levels domestically and internationally [6]. Group 5: Financial Performance and Dividends - The company plans to distribute a cash dividend of CNY 9 per 10 shares (before tax) for the 2023 fiscal year, without capitalizing reserves or issuing bonus shares [6].