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上海新阳(300236) - 2016年12月16日投资者关系活动记录表

Group 1: Company Overview - Shanghai Xinyang Semiconductor Materials Co., Ltd. is a technology-driven, innovative high-tech enterprise focused on semiconductor materials and related equipment manufacturing [1] - The company aims to develop products centered around IC manufacturing, advanced packaging, traditional packaging, IC substrates, large silicon wafers, and fluorocarbon coatings [1] - Plans to utilize capital market platforms for mergers and acquisitions to expand its development space and actively pursue international cooperation [1] Group 2: Performance and Growth - The semiconductor materials industry is expected to experience rapid growth due to national policies supporting the integrated circuit industry [2] - The company anticipates benefiting from market expansion efforts and project accumulation, with equipment and ultra-pure chemicals contributing positively to performance growth [2] - The company has a flexible production capacity with no significant bottlenecks, allowing for adjustments in production cycles [2] Group 3: Product Development and Certification - The slicing knife project has overcome technical challenges, achieving a good yield rate, with monthly sales of approximately 3,000 pieces [2] - The company’s copper interconnect plating solution has entered the central supply system of SMIC, accounting for over 80% of the procurement volume in their Beijing and Shanghai factories [2] - The company is recognized as a qualified supplier by TSMC, with ongoing certification for plating solutions at TSMC's Taiwan factory [3] Group 4: Future Prospects - The first phase of the silicon wafer project is expected to produce samples by the end of 2016, with mass production planned for 2017 at a designed capacity of 150,000 pieces per month [3] - The company has signed procurement intention agreements with SMIC, Wuhan Xinxin, and Huahong Microelectronics, indicating a positive sales outlook [3]