Workflow
上海新阳(300236) - 2015年6月30日投资者关系活动记录表

Group 1: Market Development and Product Supply - Shanghai Xinyang has become the primary supplier of copper interconnect plating solutions for SMIC, with sales of plating solutions to Wuxi Hynix Semiconductor and copper cleaning solutions to SMIC Shanghai [1] - The company's front-end wafer process chemicals are expected to be the main profit growth point, aiming for rapid revenue growth based on 2014 figures [1] Group 2: Product Performance and Market Trends - The monthly shipment of the company's slicing knife products has reached approximately 1,000 units, with a stable growth in order volume [2] - The 300mm semiconductor wafer market is currently dominant, holding a 70% market share, while the 200mm product has passed its peak [2] - In 2013, the global monthly consumption of 12-inch wafers was 5.16 million pieces, with domestic demand for 300mm wafers projected to exceed 600,000 pieces by 2017 and over 1 million pieces by 2020 [2] Group 3: Project Developments - The large wafer project has secured land and is in the process of obtaining planning and construction permits, with construction expected to commence in Q3 2015 and production planned for the end of 2016 [2] - The new 5,000-ton capacity for Kaopule has received trial production approval and has entered the trial production phase [2] Group 4: Competitive Advantages and Future Directions - Dongguan Jingyan Company has a competitive edge through proprietary research and development of direct hydrolysis production processes, leading in high-purity alumina technology [3] - The company aims to leverage capital market platforms for industry integration and business expansion, aspiring to become the largest electronic chemical materials supplier in China [3]