COTRAN(SZ:300731)2023-05-11 11:11Financial Performance - The company's net profit for 2022 decreased compared to 2021 due to several factors, including external operating challenges, increased R&D investment in the new energy sector, and higher equity incentive expenses [2] - The gross profit margin for 2022 declined compared to the previous year [2] - The company recognized impairment provisions for certain goodwill in 2022 [2] Business Development - In 2023, the company plans to strengthen its core polymer materials business while focusing on strategic development in the new energy vehicle sector [2] - The company aims to enhance lean management and improve overall operational capabilities to achieve sustainable development [3] Subsidiary Performance - The company has conducted goodwill impairment tests for its subsidiary, Ruitek, based on its business and operational conditions, and plans to continue strengthening Ruitek's business development [3] - Ruitek has received nearly twenty project approvals for its liquid cooling plate products, with some products already in mass production [4] Production Capacity - Ruitek has completed the construction of production lines for brazed and expanded liquid cooling plates, which has helped it gain first-tier supplier status with leading battery manufacturers [4] - The company is advancing the construction of two new brazed liquid cooling plate production lines, funded through a stock issuance [4] Market Expansion - The company's business is distributed across multiple regions, with a focus on South China and East China for domestic operations, and international expansion through subsidiaries in Hong Kong and Brazil [4] - The polymer materials business is expected to maintain a high gross profit margin, providing stable revenue and cash flow [4] Future Strategy - The company is developing heat management products for data centers, including phase change cooling modules in collaboration with Honeywell [5] - Future strategic focus will include expanding heat management business in response to increasing cooling demands from high-performance chips [5]