Group 1: Financial Performance - The net profit attributable to shareholders for January 2024 is projected to be between 130 million and 165 million CNY, representing a year-on-year decline of 70.09% to 62.04% due to macroeconomic conditions and low demand in the PCB industry [2][3]. Group 2: Core Competitive Advantages - The company utilizes advanced technologies such as high-speed motion control, precision machinery, electrical engineering, software algorithms, and laser technology to expand into multiple key processes in PCB production, including drilling, exposure, and testing [3]. - The company offers a one-stop solution for customers by integrating technology, products, application scenarios, supply chains, and customer collaboration, focusing on high-growth market segments [3]. Group 3: Market Expansion in Multi-layer Boards - The demand for automation equipment in the multi-layer board market is increasing, with the company launching various automated machines that significantly enhance production efficiency and reduce labor costs for downstream PCB enterprises [3]. - In the high multi-layer board market, the company has introduced advanced drilling and imaging machines to meet the high precision requirements of communication devices and AI accelerators [3]. Group 4: Progress in HDI Boards and IC Packaging Substrates - The rise of 5G smartphones and autonomous driving has increased the technical requirements for HDI boards, leading to a surge in demand for advanced laser drilling and testing machines [3][4]. - The company has made breakthroughs in the IC packaging substrate market, with products entering the high-end FC-BGA packaging sector and receiving certification from leading domestic clients [4].
大族数控(301200) - 2024年3月5日投资者关系活动记录表