证券代码：000021 证券简称：深科技 公告编码：2025-047 审议结果：同意 9 票，反对 0 票，弃权 0 票，表决通过。 深圳长城开发科技股份有限公司 第十届董事会第十五次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假记载、误 导性陈述或者重大遗漏。 深圳长城开发科技股份有限公司第十届董事会第十五次会议于 2025 年 11 月 24 日以通讯方式召开，该次会议通知已于 2025 年 11 月 19 日以电子邮件方式发 至全体董事及相关与会人员，应参与表决董事 9 人，实际参与表决董事 9 人，符 合《中华人民共和国公司法》和《公司章程》的有关规定。会议审议并通过如下 事项： 一、审议通过了《关于变更注册资本并修订<公司章程>及其附件的议案》（详 见巨潮资讯网 www.cninfo.com.cn 及同日公告 2025-048） 审议结果：同意 9 票，反对 0 票，弃权 0 票，表决通过。 二、审议通过了《关于修订<董事会审计委员会工作条例>的议案》（详见巨 潮资讯网 www.cninfo.com.cn） 审议结果：同意 9 票，反对 0 票，弃权 0 票，表决通 ...

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成 投资建议。 证券之星消息，11月24日宝盈基金管理有限公司发布《宝盈中证沪港深科技龙头指数型发起式证券投资 基金暂停赎回、转换转出业务的公告》。公告中提示，为基金进入基金财产清算程序，不再办理申购、 赎回等业务，自2025年11月24日起宝盈中证沪港深科技龙头指数型发起式证券投资基金暂停赎回、转换 转出业务，下属分级基金调整明细如下： | 分级基金筒称 | 代码 | 是否暂停（大额）申购 | 申购限额 转入限额 定投限额 | | --- | --- | --- | --- | | | | (转入转出、赎回、定投) | (元) (元) (元) | | 宝盈中证沪港深科技 龙头指数发起式A | 015820 | 를 | | | 宇察明证治意深科技 龙头指数发起式C | 015821 | 를 | | ...

证券日报网讯 深科技11月21日在互动平台回答投资者提问时表示，公司经营正常。公司高度重视自身 价值提升和股东价值回报，持续做好生产经营工作，通过实际业绩回馈股东，切实保障中小投资者的权 益。 （编辑 楚丽君） ...

融资融券数据显示，该股最新（11月20日）两融余额为18.53亿元，其中，融资余额为18.36亿元，本期 筹码集中以来融资余额合计减少1.47亿元，降幅为7.43%。 公司发布的三季报数据显示，前三季公司共实现营业收入112.78亿元，同比增长3.93%，实现净利润 7.56亿元，同比增长14.27%，基本每股收益为0.4833元，加权平均净资产收益率6.16%。（数据宝） （文章来源：证券时报网） 深科技11月21日披露，截至11月20日公司股东户数为216927户，较上期（11月10日）减少13179户，环 比降幅为5.73%。这已是该公司股东户数连续第2期下降。 证券时报·数据宝统计，截至发稿，深科技收盘价为22.52元，下跌4.58%，本期筹码集中以来股价累计 下跌19.11%。具体到各交易日，1次上涨，8次下跌。 ...

（文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：公司三季报显示有24.42亿元的存货是什么？ 深科技（000021.SZ）11月21日在投资者互动平台表示，尊敬的投资者，您好！公司存货主要包括原材 料、在产品、半成品、产成品（库存商品）等。感谢您的关注！ ...

Core Viewpoint - The stock of Shenzhen Technology Co., Ltd. (深科技) has experienced fluctuations, with a recent decline of 2.03% and a total market capitalization of 36.34 billion yuan, despite a year-to-date increase of 22.52% [1] Group 1: Stock Performance - As of November 21, the stock price is 23.12 yuan per share, with a trading volume of 1.59 billion yuan and a turnover rate of 0.44% [1] - The stock has seen a net outflow of 14.54 million yuan from main funds, with significant buying and selling activity from large orders [1] - Over the past five trading days, the stock has decreased by 6.55%, and over the past 20 days, it has dropped by 22.00% [1] Group 2: Company Overview - Shenzhen Technology Co., Ltd. was established on July 4, 1985, and listed on February 2, 1994, focusing on advanced manufacturing of hard disk heads, electronic products, and other technology [2] - The company's revenue composition includes high-end manufacturing (50.52%), storage semiconductor business (27.13%), and intelligent metering terminals (21.70%) [2] - The company operates within the electronic industry, specifically in consumer electronics and components, and is involved in various concept sectors such as advanced packaging and automotive electronics [2] Group 3: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 11.28 billion yuan, reflecting a year-on-year growth of 3.93%, and a net profit of 756 million yuan, up 14.27% [2] - The company has distributed a total of 3.96 billion yuan in dividends since its A-share listing, with 702 million yuan distributed in the last three years [3] - As of September 30, 2025, the top ten circulating shareholders include significant institutional investors, with notable changes in holdings [3]

Core Viewpoint - The company, Deep Technology, is a leading player in the high-end storage chip packaging and testing industry in China, leveraging its technological and process capabilities to meet increasing market demands [1][4]. Group 1: Technological Capabilities - The company has a well-established technology and process system, which is crucial for high-end storage chip packaging due to high technical barriers in design, multi-layer stacking, and testing software and hardware coordination [1]. - Deep Technology possesses a skilled R&D and engineering team with mature capabilities in multi-layer stacking packaging, fine welding, and thermal optimization, along with in-house software development for customized testing solutions [3]. Group 2: Production Capacity and Expansion - Currently, the production lines in Shenzhen and Hefei are operating at full capacity, and the company is planning to expand production in response to increasing customer orders [4]. - The company is closely monitoring key customers' business dynamics and is strategically planning its long-term capacity layout based on industry trends and market demand [4]. - The expansion process will be managed to ensure product quality and delivery stability while gradually increasing new capacity [4]. Group 3: Market Outlook - Industry experts believe that the recovery in the storage industry and a new round of technological upgrades will benefit the high-end storage chip packaging segment, with increasing demand for reliable domestic packaging capacity from downstream customers [4]. - Deep Technology's expansion in its packaging bases, combined with its technological and customer resource advantages, is expected to further solidify its leading position in the domestic high-end storage chip packaging sector [4].

Group 1 - Moer Thread announced an issuance price of 114.28 CNY per share, with a total of 70 million shares to be publicly issued, aiming to raise 8 billion CNY, netting approximately 7.576 billion CNY after expenses [1] - EVE Energy signed a procurement framework agreement with Simo International for battery cells from 2026 to 2028, with the agreement effective until December 31, 2028, but does not specify a concrete amount [1] - Tuojing Technology's major shareholder, the National Integrated Circuit Industry Investment Fund, plans to reduce its stake by up to 3% through block trading from December 12, 2025, to March 11, 2026 [1] Group 2 - Shengyi Electronics announced that its shareholder, Dongguan Science and Technology Innovation Investment Group, plans to reduce its stake by up to 1% from December 12, 2025, to March 11, 2026, due to funding needs [2] - Deep Technology reported that it is a leading domestic high-end storage chip packaging and testing company, currently operating at full capacity in Shenzhen and Hefei, and is expanding based on customer demand [2] - Wengfeng Co. announced that its deputy general manager, Qin Guofen, is under investigation, but this matter is personal and will not significantly impact the company's operations [2] Group 3 - Fosun Pharma's subsidiary, Shanghai Fuhong Hanlin Biotechnology, has had its drug, Surulitinib, included in the breakthrough therapy designation for gastric cancer, with no other PD-1 monoclonal antibody approved for this indication globally [3] - Daye Co. is responding to the EU's anti-dumping investigation on Chinese lawnmowers, adjusting its overseas production structure and integrating resources to mitigate impacts [4]

深科技发布投资者关系活动记录表公告称，存储芯片封装在行业中存在较高的技术壁垒。作为国内高端 存储芯片封测的龙头企业，公司拥有行业经验丰富的研发和工程团队，具备精湛的多层堆叠封装工艺能 力和测试软件开发能力。公司目前深圳、合肥封测处于满产状态，并根据客户近期需求在扩产。 ...

投资者关系 活动类别 □特定对象调研 □分析师会议 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □现场参观 ☑ 其他（2025 年度深圳辖区上市公司投资者网上集体接待日活动） 参与单位名称 及人员姓名 投资者网上提问 时间 2025 年 11 月 20 日 (周四) 下午 15:40~17:00 地点 公司通过全景网"投资者关系互动平台"（https://ir.p5w.net）采用网 络远程的方式召开"2025 年度深圳辖区上市公司投资者网上集体接待日 活动" 上市公司 接待人员姓名 董事，副总裁周庚申 副总裁,财务负责人莫尚云 董事会秘书钟彦 投资者关系活 动主要内容介 绍 1、公司与广东省国家数字经济创新发展试验区建设方案关联度大不 大？ 答：尊敬的投资者，您好！公司将密切关注宏观经济与政策动向，力 求为公司和股东创造长期、稳定的价值。感谢您的关注！ 2、截止11月20日股东数量是多少？ 答：尊敬的投资者，您好！截至2025年11月10日，公司股东户数为 230,106户。感谢您的关注！ 3、合肥二期工厂的HBM3封测产线，是否已经正式商用？ 答：尊敬的投资者，您好！作为国内高端存储芯片封测的龙头 ...