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Ansys Listed in AWS "ICMP" for the US Federal Government
Prnewswire· 2024-07-09 12:57
Ansys STK is now available to US Government Customers in ICMPPITTSBURGH, July 9, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) a global leader in engineering simulation software solutions, today announced that it is listing Ansys STK™ in the AWS Marketplace for the US Intelligence Community (ICMP). ICMP is a curated digital catalog from Amazon Web Services (AWS) that makes it easy to discover, purchase, and deploy software packages and applications from vendors that specialize in supporting government customers ...
Ansys Multiphysics Signoff Solutions Certified for Samsung's 2nm Power Backside Delivery Technology
Prnewswire· 2024-06-26 13:00
Core Insights - Ansys power integrity platforms, specifically RedHawk-SC™ and Totem™, have been certified for Samsung's SF2Z 2nm manufacturing technology, enabling advanced semiconductor product design for various high-performance applications [2][3] Group 1: Technology and Certification - The certification of Ansys solutions allows early adopters to design leading-edge semiconductor products for high-performance computing (HPC), smartphones, artificial intelligence (AI), data center communication, and graphics processors [2] - Samsung's SF2Z technology features a power distribution network relocated to the backside of the chip, which saves space, reduces costs, and enhances performance [2][3] Group 2: Product Features - RedHawk-SC provides accurate signoff verification for electromigration and voltage drop (IR drop) on power distribution networks for digital designs, while Totem offers comprehensive evaluation for analog and mixed-signal designs [3] - Both platforms aim to reduce project risk, improve reliability, and extend the longevity of chips [3] Group 3: Collaboration and Commitment - Samsung Foundry and Ansys have collaborated closely to ensure mutual customers have timely access to necessary design tools, addressing challenges in digital, full-custom, mixed-signal, and 3D-IC designs [3] - The partnership emphasizes the commitment of both companies to deliver technology solutions that meet semiconductor technology needs, enhancing the user experience for joint customers [3]
Ansys Joins Intel Foundry's United States Military, Aerospace, and Government (USMAG) Alliance
Prnewswire· 2024-06-24 15:30
Core Insights - Ansys is collaborating with Intel Foundry to enhance thermal management technology for the Intel 18A silicon process, focusing on high-performance computing, graphics, and AI products for U.S. national security applications [1][2][3] Group 1: Collaboration and Alliance - Ansys has joined the Intel Foundry Accelerator USMAG Alliance to support secure chip design methodologies for military, aerospace, and government applications [2][4] - The collaboration aims to optimize Ansys' semiconductor simulation tools to meet the requirements of Intel Foundry's process design kits (PDKs) [2][3] Group 2: Technical Enhancements - Ansys is enhancing its Redhawk-SC platform to provide a comprehensive thermal management flow for the Intel 18A process, which includes innovative backside power delivery technology, PowerVia [3][4] - The partnership will also focus on signoff verification of thermal and power integrity, as well as mechanical reliability for Intel's embedded multi-die interconnect bridge (EMIB) technology [3][4] Group 3: Industry Impact - The collaboration addresses complex multiphysics challenges and stringent requirements in thermal, power, mechanical, and reliability aspects for military and aerospace products [4] - Ansys' simulation capabilities are expected to deliver greater value to customers in the semiconductor industry, particularly in the context of national security [4]
Ansys (ANSS) Unveils ConceptEV Platform to Advance EV Designs
ZACKS· 2024-06-21 14:05
Group 1: Ansys Product Launch - Ansys launched Ansys ConceptEV, a SaaS solution for EV powertrain design, enabling collaboration among engineers on a shared system model [1][2] - ConceptEV connects component designs to system-level requirements, facilitating quick analysis and reducing errors, time, and costs [2] Group 2: Competitive Edge and Partnerships - Ansys has a competitive edge through innovative product launches, including AnsysGPT, an AI-driven virtual support platform [3] - The company partnered with NVIDIA to enhance 3D integrated circuit design using Ansys' multiphysics simulation capabilities [3] Group 3: Acquisition and Shareholder Approval - Ansys signed an agreement to be acquired by Synopsys for approximately $35 billion, with shareholders set to receive $197 in cash and 0.3450 shares of Synopsys common stock per ANSS share [3] Group 4: Stock Performance - Ansys currently holds a Zacks Rank 4 (Sell) and has shown no change in stock price over the past year, contrasting with a 26.7% growth in its sub-industry [4]
Ansys (ANSS) Uses NVIDIA Omniverse Platform for 3D-IC Designs
ZACKS· 2024-06-20 14:00
Ansys (ANSS) is leveraging NVIDIA Corporation’s (NVDA) Omniverse application programming interfaces (APIs). This will “supercharge” the design of 3D integrated circuits (3D-ICs) through the integration of Ansys' multiphysics simulation capabilities with the Omniverse platform.NVDA is the worldwide leader in visual computing technologies and the inventor of the graphic processing unit, or GPU. Over the years, the company’s focus has evolved from PC graphics to artificial intelligence (AI) based solutions tha ...
Ansys Debuts ConceptEV to Boost Electric Vehicle Drive Range
Prnewswire· 2024-06-20 13:00
ConceptEV optimizes the development of electric vehicle powertrains for improved driving range and battery charge times/ Key HighlightsAnsys ConceptEV™, a software-as-a-service (SaaS) solution tailor-made for the automotive concept design stage, delivers simultaneous optimization of electric vehicle (EV) powertrain architectures and components including the battery, inverter, motor, and transmissionThe solution complements existing simulation workflows, empowering system and component design engineering tea ...
Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse
Prnewswire· 2024-06-19 13:00
Ansys to demonstrate 3D multiphysics visualization of electromagnetic and thermal effects in semiconductor packages at Design Automation Conference / Key Highlights Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a system-on-a-chip By transforming data into meaningful visual insights, the Ansys multiphysics platform empowers IC designers to interact with models of electroma ...
Ansys (ANSS) Shareholders Approve Acquisition by Synopsys
zacks.com· 2024-05-23 18:10
Ansys (ANSS) announced that its shareholders have voted to approve the proposed acquisition by Synopsys. The terms of the agreement outline that Ansys shareholders will receive $197 in cash along with 0.3450 shares of Synopsys common stock for each Ansys share.Ansys added that about 98.7% of the shareholders voted in favor of the acquisition, which represented approximately 83.8% of the total outstanding shares of the company’s common stock. This deal, valued at approximately $35 billion, reflects an implie ...
Ansys Stockholders Approve Transaction with Synopsys
Prnewswire· 2024-05-22 20:05
Represents Key Milestone Toward Completion of Transaction with Synopsys PITTSBURGH, May 22, 2024 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced that at the special meeting of stockholders (the "Special Meeting") held earlier today, its stockholders voted to approve the proposed acquisition of Ansys by Synopsys, Inc. (NASDAQ: SNPS). Under the terms of the merger agreement, Ansys stockholders will receive $197.00 in cash and 0.3450 shares of Synopsys common stock for each Ansys share they own, represent ...
Ansys' Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
Prnewswire· 2024-05-07 13:00
Collaboration enables accelerated materials discovery to optimize product development/ Key Highlights Ansys and Schrödinger are collaborating to develop an integrated computational materials engineering (ICME) approach to product development that infuses virtual materials discovery into the early stages of design The predictive accuracy of Ansys multiphysics solutions combined with Schrödinger's materials solutions help engineers identify suitable materials for their designs before manufacturing begins PIT ...