EXHIBIT 99.1 Contact: Investors: Kelsey DeBriyn 724.820.3927 kelsey.debriyn@ansys.com Media: Mary Kate Joyce 724.820.4368 marykate.joyce@ansys.com Ansys Announces Q3 Financial Results / Q3 2024 Results • Revenue of $601.9 million • GAAP diluted earnings per share of $1.46 and non-GAAP diluted earnings per share of $2.58 • GAAP operating profit margin of 26.8% and non-GAAP operating profit margin of 45.8% • Operating cash flows of $174.2 million and unlevered operating cash flows of $184.5 million • Annual c ...

/ Q3 2024 Results Revenue of $601.9 millionGAAP diluted earnings per share of $1.46 and non-GAAP diluted earnings per share of $2.58GAAP operating profit margin of 26.8% and non-GAAP operating profit margin of 45.8%Operating cash flows of $174.2 million and unlevered operating cash flows of $184.5 millionAnnual contract value (ACV) of $540.5 millionDeferred revenue and backlog of $1,463.8 million on September 30, 2024 PITTSBURGH, Nov. 06, 2024 (GLOBE NEWSWIRE) -- ANSYS, Inc. (NASDAQ: ANSS), today reported t ...

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies/ Key Highlights Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE) Ansys' joint developme ...

PITTSBURGH, Oct. 17, 2024 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) announced today that the Company expects to release its third quarter earnings on Wednesday, November 6, 2024, after the market closes. As previously announced, in light of the pending transaction with Synopsys, Inc. (Synopsys), Ansys has suspended quarterly earnings conference calls and no longer provides quarterly or annual guidance.After the market closes on Wednesday, November 6, 2024, you can find the following information on the inve ...

ANSYS Inc.’s (ANSS) flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs). These advanced designs are critical for creating more innovative products with better performance, improved reliability and reduced power usage. Faraday is a premium provider of application-specific integrated circuits or ASIC design services, and the company is known for its extensive silicon Internet Pro ...

Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals/ Key Highlights Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs)Ansys solutions will enable Faraday to optimize its interposer and multi-die designs, supporting better memory bandwidth, signal integri ...

ANSYS Inc (ANSS) recently expanded its long-standing collaboration with TSMC to transform the semiconductor industry by leveraging artificial intelligence (AI) to advance multiphysics solutions to further develop semiconductor technologies and workflows for high-efficiency designs. The initiative will likely address the complexities of designing chips for modern applications like AI, high-performance computing (HPC), data center connectivity and wireless telecommunications. The partnership aims to streamlin ...

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors/ Key HighlightsAnsys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers' reliability analysis need ...

ANSYS Inc (ANSS) , TSMC and Microsoft (MSFT) have successfully tested a solution that enhances the simulation and analysis process of silicon Photonic Integrated Circuits (PICs). The joined forces have yielded a 10X speed-up in Ansys’ Lumerical FDTD photonic simulations using Microsoft Azure’s NC A100v4-series virtual machines powered by NVIDIA accelerated computing technology operating on Azure AI infrastructure. Silicon PICs (category of optical communications) are a critical component of hyperscale data ...

Big Data refers to vast and diverse collections of structured, unstructured and semi-structured data that inundate businesses on a day-to-day basis. It encompasses the volume of information spurred by digital technology advancements, the velocity or speed at which it is created and collected, and the variety or scope of the data points being covered (known as the "three V's" of Big Data). Over the past few years, three additional V's have gained precedence - value, variability and veracity.By defining big d ...