NavInfo(SZ:002405) Zhong Guo Qi Che Bao Wang·2025-04-24 03:33Core Insights - Shenzhen Hangseng Electronics Co., Ltd. and Beijing Four-Dimensional Map Technology Co., Ltd. signed a strategic cooperation agreement to enhance automotive intelligence technology and industry upgrades [1][3] Group 1: Strategic Cooperation - The partnership will leverage the technical strengths of both companies, focusing on advanced driver assistance systems, intelligent cockpits, big data platforms, and manufacturing [1][3] - A joint research and development team will be established to innovate in areas such as chip design, combined driver assistance systems, and AI model applications [4] Group 2: Technological Collaboration - Both companies will collaborate on next-generation chip development, exploring innovative industry cooperation models and promoting joint technology and business initiatives [4] - In the intelligent cockpit sector, they will work on software applications, cloud services, and AI model applications to create user-centric solutions [4] Group 3: Manufacturing and Supply Chain - Hangseng will provide high-quality manufacturing support to Four-Dimensional Map, enhancing production capacity and delivery efficiency [4] - The collaboration aims to create a full lifecycle competitive advantage covering research, production, delivery, and recycling in the smart automotive supply chain [4][5] Group 4: Future Outlook - The partnership seeks to redefine traditional supply chain collaboration by establishing a new industry relationship characterized by technological symbiosis, capacity resonance, and data sharing [5] - The goal is to provide automotive companies with comprehensive capabilities from chips to cloud services, enhancing safety and intelligence in user travel experiences [5]