TSMC(US:TSM) 3 6 Ke·2025-05-05 23:13Group 1: Core Insights - TSMC's recent conference highlighted the rapid expansion of the semiconductor industry, projecting a market size of $1 trillion by 2030, driven primarily by high-performance computing (HPC) and artificial intelligence (AI) applications [2][4] - By 2030, HPC/AI is expected to dominate the semiconductor market, accounting for 45%, while smartphones will represent 25%, automotive electronics 15%, IoT 10%, and other sectors 5% [4][6] - The demand for semiconductors is accelerating due to AI-driven applications, including AI accelerators in data centers, AI PCs, AI smartphones, and long-term applications like robotic taxis and humanoid robots [4][6] Group 2: Advanced Process Technologies - TSMC's N3 series (3nm process) includes N3, N3E, and upcoming versions like N3P, which will enhance performance by 5% while reducing power consumption by 5% to 10% [7][9] - The N2 process (2nm) is expected to achieve a 10%-15% speed improvement or a 20%-30% power reduction compared to previous technologies, with transistor density increasing by 15% [12][18] - A16 technology, set for production in 2026, will utilize a super power rail architecture to improve logic density and efficiency, achieving an 8%-10% performance boost and a 15%-20% power reduction compared to N2P [19][20] Group 3: Advanced Packaging and System Integration Innovations - TSMC introduced the 3DFabric platform, which includes 2.5D and 3D integration technologies to overcome traditional design limitations and support high-density memory integration [24][30] - The CoWoS technology supports high-density interconnects and has been successfully applied in advanced products like Tesla's Dojo supercomputer [28][33] - Future applications, such as augmented reality glasses and humanoid robots, will require advanced packaging technologies to integrate numerous high-performance chips efficiently [37][40]