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衡封新材Pre-B轮融资数千万,国产电子级树脂赛道再添新动力

Core Insights - Shanghai Hengfeng New Materials Technology Co., Ltd. has successfully completed a Pre-B round financing of several tens of millions, led by Yida Capital, with participation from Lingang Digital Fund and Shangyan Xinguang Fund, alongside existing investor Yaotu Capital increasing its stake [1] - The company has previously secured nearly 100 million in A round financing in December 2023, led by Yaotu Capital and Yuanhe Puhua, with contributions from Yonghua Capital and Ruixia Investment, bringing total financing to over 100 million, which will enhance its product supply system and strategic deployment in the electronic-grade specialty phenolic resin and specialty phenolic epoxy resin markets [3] Company Overview - Established in September 2018 in Shanghai, Hengfeng New Materials has assembled a team of elites from renowned institutions like East China University of Science and Technology, with over 20 years of experience in phenolic and epoxy resin technology, production, and sales [3] - The company aims to become a leader in global electronic-grade specialty phenolic resin and specialty phenolic epoxy resin technology [3] Market Context - There is a significant demand for electronic-grade specialty phenolic resin and specialty phenolic epoxy resin, but the domestic market heavily relies on imports [3] - Hengfeng New Materials recognizes the urgency of achieving "Made in China" and seeks growth points through domestic production, with its products widely used in copper-clad laminates, epoxy encapsulants, photoresists, electronic adhesives, and other composite materials [3] Production Capacity - To meet the growing market demand, Hengfeng New Materials has established modern production lines in Anhui and Taizhou, with a production base in Bengbu, Anhui, set to commence operations soon, ensuring sufficient capacity for customers and further promoting the domestic substitution process for electronic-grade specialty phenolic resin and specialty phenolic epoxy resin [3]