雷军：小米自研SoC芯片采用3nm制程

Core Viewpoint - Xiaomi's upcoming self-developed SoC chip "Xuanjie O1" is set to be released, utilizing a second-generation 3nm process technology, surpassing market expectations and marking a significant milestone for China's semiconductor industry [1] Group 1: Chip Development and Investment - Xiaomi has invested over 135 billion RMB in the development of the Xuanjie chip as of April this year, with an expected investment of over 60 billion RMB this year [1] - The R&D team for the Xuanjie chip has grown to over 2,500 members, positioning Xiaomi among the top three in the domestic semiconductor design sector in terms of investment and team size [1] Group 2: Industry Context and Challenges - The semiconductor industry is experiencing a slowdown in Moore's Law, with international giants also reducing their pace in chip miniaturization, making this a critical moment for China's chip development [1][3] - The design and manufacturing of chips are equally important, and achieving breakthroughs in both areas is essential for China to catch up with global leaders [2][3][7] Group 3: Historical Context and Future Prospects - Xiaomi has been committed to semiconductor and operating system development since 2014, with over 100 billion RMB invested in R&D over the past five years [5] - The Xuanjie chip, with 19 billion transistors, represents a significant achievement in mobile SoC design, allowing Xiaomi to compete with global giants like Apple and Samsung [5] - The breakthrough in 3nm chip design is expected to have a positive impact on the domestic industry, attracting talent and enhancing product synergy [7]