GRIPM(SH:688456) Ge Long Hui·2025-07-31 08:28Core Viewpoint - The company has successfully applied its thermal copper powder and certain copper materials in AI computing servers, indicating a stable shipment volume and potential for growth in sales and profits due to increasing demand in the AI sector [1] Company Summary - The new thermal copper powder is produced using a chemical method, featuring a gradient pore structure, developed specific surface area, and low bulk density [1] - Performance improvements in thermal efficiency range from 10% to 20% compared to traditional atomized copper powder, with thermal end benefits of 3 to 5 degrees Celsius [1] - The innovative product is a first in the industry, positioning the company favorably as AI applications like DeepSeek become more prevalent [1] Industry Summary - The growing demand for hardware cooling and acceleration in AI applications is expected to drive further sales expansion for the company's new thermal copper powder [1]