有研粉材：散热铜粉和部分铜粉材料已成功应用于AI算力服务器

Core Viewpoint - The company has successfully applied its thermal copper powder and certain copper materials in AI computing servers, indicating a stable shipment volume and potential for profit growth due to increasing demand in the AI sector [1] Group 1: Product Innovation - The new thermal copper powder is produced using a chemical method, featuring a gradient pore structure, developed specific surface area, and low bulk density [1] - The performance of the new thermal copper powder improves heat dissipation efficiency by 10%-20% compared to traditional atomized copper powder, with a thermal end benefit of 3-5℃ [1] Group 2: Market Demand - The growing popularity of AI applications, such as deepseek, is driving higher requirements for hardware cooling and speed, which positions the company's new thermal copper powder for expanded sales [1] - The company’s innovative products are expected to create a new profit growth point as demand in the AI sector increases [1]