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华天科技(002185.SZ)：没有CoWoP封装技术
Tianshui Huatian Technology Tianshui Huatian Technology (SZ:002185) Ge Long Hui·2025-08-01 07:20

Group 1 - The company Huada Semiconductor (002185.SZ) has stated on its interactive platform that its eSinC 2.5D packaging technology platform includes SiCS, FoCS, and BiCS, which are comparable to CoWoS-related technologies [1] - The company does not possess CoWoP packaging technology [1]