兴森科技(002436.SZ)：CSP封装基板产能已处于满产状态

Group 1 - The company, Xingsen Technology (002436.SZ), has reported that its CSP packaging substrate production capacity is currently at full capacity and is in the process of expansion [1] - The market development and customer certification for the FCBGA packaging substrate project are progressing steadily as planned [1]