兴森科技(002436.SZ)：FCBGA封装基板项目目前处于小批量生产阶段

Group 1 - The company is currently in the small batch production phase for its FCBGA packaging substrate project [1] - Market expansion and customer certification are progressing steadily as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the customer's own production progress, and their supplier management strategies [1]