24亿元引入新股东，晶合集成拟H股上市

Core Viewpoint - Jinghe Integrated aims to deepen its international strategy, accelerate overseas business development, enhance its overall competitiveness and international brand image, and optimize its capital structure through H-share listing [2] Group 1: Company Overview - Jinghe Integrated was established in 2015 and primarily engages in 12-inch wafer foundry services [2] - The company has achieved mass production on process nodes from 150nm to 55nm, with small batch production of 40nm high-voltage OLED display driver chips and successful functional verification of 28nm logic chips [2] - Jinghe Integrated's technology capabilities include wafer foundry for display driver chips (DDIC), CMOS image sensor chips (CIS), power management chips (PMIC), microcontroller chips (MCU), and logic chips [2] Group 2: Market Position - Jinghe Integrated has successfully become the ninth largest wafer foundry globally, driven by market demand and the trend of domestic production [3] - According to TrendForce, the overall revenue of the global wafer foundry industry is expected to decrease by approximately 5.4% in Q1 2025, amounting to $36.4 billion, while Jinghe Integrated's revenue is projected to grow by 2.6% to $353 million due to urgent orders from clients [3][5] Group 3: Strategic Developments - On July 29, Jinghe Integrated introduced Huqin Technology as a strategic shareholder, transferring 120,368,109 shares (6.00% of total shares) at a price of 19.88 yuan per share, totaling approximately 2.4 billion yuan [6] - Following the share transfer, the stake of the previous major shareholder, Liching Innovation Investment Holdings, decreased from 19.08% to 13.08%, while Huqin Technology acquired a 6.00% stake [7] - Huqin Technology specializes in the research, design, production, and operation of smart hardware products, serving various industries including consumer electronics and automotive electronics [7]