一文读懂英伟达下一代芯片封装技术“CoWoP”

Core Viewpoint - Morgan Stanley's latest report highlights that Nvidia is exploring a revolutionary chip packaging technology called CoWoP (Chip-on-Wafer-on-PCB), which is expected to replace the existing CoWoS packaging solution [1] Group 1: CoWoP Technology Overview - CoWoP technology involves directly mounting the intermediary layer (with chips) onto the PCB after the chip-wafer intermediary layer manufacturing step, unlike CoWoS which binds to the ABF substrate [2] - The potential advantages of CoWoP include simplified system architecture, improved data transmission efficiency, better thermal management, lower power consumption, reduced substrate costs, and potential elimination of some backend testing steps [5] Group 2: Supply Chain Impact - The report indicates that the CoWoP technology poses a significant negative impact on ABF substrate manufacturers, as the added value of substrates may decrease or disappear, while PCB manufacturers stand to gain significantly [6] - The main challenge for PCB manufacturers is balancing performance with high current/voltage requirements, with mSAP being the best PCB technology for achieving finer line/space dimensions [6] Group 3: Commercialization Challenges - Morgan Stanley analysts believe that the probability of CoWoP's commercialization in the medium term is low due to multiple technical challenges [7] - Current PCB technology, even with mSAP, can only achieve line/space widths of 20-30 microns, which is still significantly below the desired performance [8] Group 4: Nvidia's Innovation Leadership - Regardless of the success of CoWoP, Nvidia continues to lead innovation in data center AI infrastructure through a system-level approach [9] - Nvidia's ongoing innovation capabilities are expected to maintain its leading position in the GPU sector and dominate competition with ASICs in the coming years [9]