Suntak(SZ:002815) Ge Long Hui·2025-08-05 07:26Core Viewpoint - Chongda Technology (002815.SZ) has successfully established a mSAP (Modified Semi-additive Process) production line, which is set to officially commence production in September 2023, focusing on high-end applications in RF packaging substrates, SiP packaging substrates, PMIC packaging substrates, and TPMS substrates [1] Group 1 - The mSAP process has achieved mass production capabilities with a line width/spacing of 20/20 micrometers, while the ETS buried line process can reach a line width/spacing of 15/15 micrometers, meeting the demand for advanced packaging substrates [1] - Products made using the mSAP process are already being shipped in large quantities, indicating a successful transition to mass production [1] - The company is currently centered on advanced packaging substrates and is building a technological moat through mSAP process upgrades and customer certification systems [1] Group 2 - The COWOP technology is still in the industry research and validation phase, and the company has not yet directly engaged in COWOP packaging [1] - The company's experience in high-precision PCB manufacturing, advanced packaging substrates, and AI server fields provides potential for future involvement in higher-level packaging technology integration [1] - The company will continue to monitor industry trends and assess technology extension paths based on market demand and technological maturity [1]