JTGROUP(SH:601609) Ge Long Hui·2025-08-13 07:34Core Viewpoint - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Summary - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the early companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision special oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in the new AI cooling structure of 3DVC [1] - Strategic partnerships have been established with several top-tier cooling module companies, and the products are applied in multiple high-end GPU cooling solutions [1] - The company’s independently developed copper heat pipes and liquid-cooled copper pipes have been successfully integrated into the products of several leading enterprises in the computing server market [1] - The company will closely monitor and follow market demand in these areas to further enhance its product lineup and competitive advantages [1]