芯碁微装筹划发行H股股票并在香港联交所上市

Group 1 - The company, Chipbond Technology Corporation (688630.SH), announced plans to issue shares overseas (H-shares) and apply for listing on the main board of the Hong Kong Stock Exchange to enhance its global strategy and brand image [1] - The initiative aims to diversify the company's financing channels and further strengthen its core competitiveness [1] - The company will consider the interests of existing shareholders and the conditions of domestic and international capital markets when determining the timing and window for the issuance and listing, which will be completed within 18 months following the approval of the shareholders' meeting [1]