生益电子拟投资约19亿元用于智能制造高多层算力电路板项目

Core Viewpoint - The company plans to invest approximately 1.9 billion RMB in a smart manufacturing high-layer circuit board project to meet the growing demand in the mid-to-high-end market, particularly for servers and AI computing [1][2]. Group 1: Project Overview - The project will be implemented by the company's wholly-owned subsidiary in Jiangxi Province, with a total investment of about 1.9 billion RMB, including previously invested costs [1]. - The new investment for this project is approximately 1.75 billion RMB, with a planned construction period of 2.5 years [1]. - The project is set to be executed in two phases, with the first phase expected to begin trial production in 2026 and the second phase in 2027 [1]. Group 2: Market Focus and Capacity Planning - The project focuses on the smart manufacturing of high-layer circuit boards, targeting the needs of servers, high-layer network communications, and the rapidly growing AI computing market [2]. - The planned production capacity is 700,000 square meters of printed circuit boards annually, with each phase producing 350,000 square meters [2]. - The advancement of this project is expected to enhance the company's resource integration and optimize capacity layout, aligning better with market demand growth [2].