Group 1 - Huahai Qingsi Co., Ltd. has completed a strategic investment in Suzhou Bohongyuan Equipment Co., Ltd. [1] - Huahai Qingsi, established in 2013 and listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board in 2022, specializes in semiconductor equipment manufacturing, including CMP, thinning, and cutting equipment [1] - Suzhou Bohongyuan, founded in 2016, focuses on high-precision grinding and polishing equipment for hard and brittle materials, successfully entering overseas markets [1] Group 2 - The power semiconductor sector is evolving towards higher efficiency and power density, particularly with the adoption of wide bandgap semiconductor technologies like silicon carbide and gallium nitride, which demand improved substrate material performance [1] - Advanced packaging technology is also raising stringent standards for substrate flatness and purity, driving increased market demand for silicon carbide and gallium nitride [1] - The collaboration between Huahai Qingsi and Suzhou Bohongyuan aims to leverage their expertise in precision manufacturing equipment to create a one-stop platform for thinning, grinding, and polishing equipment, expanding market opportunities [2]
华海清科投资一家化合物设备企业!