华海清科王科：把握先进封装与第三代半导体机遇

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [4][5] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like photolithography [4][5] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining rapid polishing precision, and ensuring efficient and stable operation of the entire machine [4][5] - The demand for CMP equipment is expected to rise significantly due to advancements in packaging technologies such as TSV and 3D packaging, as well as the shift from multi-wafer to single-wafer polishing in third-generation semiconductors [5][6] - Huahai Qingshi, originating from Tsinghua University's State Key Laboratory of Tribology, has evolved from a CMP equipment supplier to a comprehensive platform covering various semiconductor equipment and services, establishing itself as a leading domestic supplier [5][6] - The continuous drive for progress in the industry is fueled by demand and technological iteration, with Huahai Qingshi committed to leveraging its technological expertise to support breakthroughs in China's semiconductor industry [6]